Semiconductor Packaging / Electronics
IC Packaging Fair
ICPF
Semiconductor and IC packaging and test exhibition held within NEPCON ASIA at Shenzhen World Exhibition & Convention Center.
Dates
Oct 27, 2026 – Oct 29, 2026
Event date has passed
Venue
SHENZHEN WORLD EXHIBITION & CONVENTION CENTER
No. 1 Zhancheng Rd, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China
Semiconductor and IC packaging and test exhibition held within NEPCON ASIA at Shenzhen World Exhibition & Convention Center.
Dates & Locations
Oct 27, 2026 – Oct 29, 2026 600 exhibitors · 700,000 attendees
No. 1 Zhancheng Rd, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China
Event Information
Website:https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html
Also known as: NEPCON ASIA IC Packaging Fair, NEPCON ASIA - ICPF
Source: Expomax Atlas legacy
