Thermal Interface Materials

Data center heat management is a critical issue, especially as optical components are seeing density and power increase to address speed and bandwidth demands. On-device thermal control is most effectively achieved with thermal interface materials – both in the optical subassembly and as a heat-dissipating accelerator between the transceiver surface and riding heat sink. Award-winning BERGQUIST ® thermal management materials in liquid, pad, adhesive and gel formats offer process adaptability, a wide range of thermal conductivities, and low assembly stress for excellent performance and long-term optical device reliability.