High Speed Laser Depaneling

Lasertool for machining of ceramics CR20x0 Ideal for use in the manufacture of ceramic printed circuit boards and particularly suitable for applications where high process speeds and accuracy are required. Highlights: High traversing speed combined with very good axis dynamics make the machines in this series stand out. Ultra-short pulse laser technology high process speed on all ceramic substrates (i.e. Al2O3, AlN, Si3N4, SiO2, ZrO2, HTCC, LTCC) 30μm minimum hole diameter Can be extended to several process heads on request | Laser Depaneling Redefined Zero Stress. Infinite Flexibility. Micron-precise, clean, and stress-free PCB separation with today's advanced laser systems delivering unmatched performance at the lowest total cost in years. No compromises on quality or your bottom line. Non-contact cutting: Eliminates stress Clean, burr-free edges Higher yields and material savings: Tighter panel layouts reduce waste up to 30%